Issue

Vol. 14 (2022)

Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application

https://doi.org/10.1007/s40820-022-00868-8
Chang‑Ping Feng
Shandong Engineering Research Center for Additive Manufacturing, Qingdao University of Technology, Qingdao 266520, People’s Republic of China
Fang Wei
State Key Laboratory of Polymer Materials Engineering, College of Polymer Science and Engineering, Sichuan University, Chengdu 610065, People’s Republic of China
Kai‑Yin Sun
Shandong Engineering Research Center for Additive Manufacturing, Qingdao University of Technology, Qingdao 266520, People’s Republic of China
Yan Wang
Shandong Engineering Research Center for Additive Manufacturing, Qingdao University of Technology, Qingdao 266520, People’s Republic of China
Hong‑Bo Lan
Shandong Engineering Research Center for Additive Manufacturing, Qingdao University of Technology, Qingdao 266520, People’s Republic of China
Hong‑Jing Shang
Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing 100190, People’s Republic of China
Fa‑Zhu Ding
Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing 100190, People’s Republic of China
Lu Bai
State Key Laboratory of Polymer Materials Engineering, College of Polymer Science and Engineering, Sichuan University, Chengdu 610065, People’s Republic of China
Jie Yang
State Key Laboratory of Polymer Materials Engineering, College of Polymer Science and Engineering, Sichuan University, Chengdu 610065, People’s Republic of China
Wei Yang
State Key Laboratory of Polymer Materials Engineering, College of Polymer Science and Engineering, Sichuan University, Chengdu 610065, People’s Republic of China

Corresponding Author: Wei Yang

weiyang@scu.edu.cn

Nano-Micro Letters, Vol. 14 (2022), Article Number: 127

Abstract

Effective thermal management is quite urgent for electronics owing to their ever-growing integration degree, operation frequency and power density, and the main strategy of thermal management is to remove excess energy from electronics to outside by thermal conductive materials. Compared to the conventional thermal management materials, flexible thermally conductive films with high in-plane thermal conductivity, as emerging candidates, have aroused greater interest in the last decade, which show great potential in thermal management applications of next-generation devices. However, a comprehensive review of flexible thermally conductive films is rarely reported. Thus, we review recent advances of both intrinsic polymer films and polymer-based composite films with ultrahigh in-plane thermal conductivity, with deep understandings of heat transfer mechanism, processing methods to enhance thermal conductivity, optimization strategies to reduce interface thermal resistance and their potential applications. Lastly, challenges and opportunities for the future development of flexible thermally conductive films are also discussed.


Highlights:


1 The state-of-the-art progress of flexible thermally conductive films with ultrahigh in-plane isotropic thermal conductivity (k) and potential application are summarized.
2 The heat transfer mechanism, processing methods to enhance k, optimization strategies to reduce interface thermal resistance of flexible thermally conductive films are reviewed.
3 The limitations and opportunities for the future development of flexible thermally conductive films are proposed.

Keywords

Thermal conductivity Flexible thermally conductive films Heat transfer mechanism Interface thermal resistance Thermal management applications
Feng, Chang‑Ping, Fang Wei, Kai‑Yin Sun, Yan Wang, Hong‑Bo Lan, Hong‑Jing Shang, Fa‑Zhu Ding, Lu Bai, Jie Yang, and Wei Yang. 2022. “Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application”. Nano-Micro Letters 14 (June):127. https://doi.org/10.1007/s40820-022-00868-8.
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