Issue

Vol. 16 (2024)

3D-Printed Carbon-Based Conformal Electromagnetic Interference Shielding Module for Integrated Electronics

https://doi.org/10.1007/s40820-023-01317-w
Shaohong Shi
State Key Laboratory of Featured Metal Materials and Life‑Cycle Safety for Composite Structures, School of Resources, Environment and Materials, Guangxi University, No. 100, Daxuedong Road, Nanning 530004, People’s Republic of China
Yuheng Jiang
State Key Laboratory of Featured Metal Materials and Life‑Cycle Safety for Composite Structures, School of Resources, Environment and Materials, Guangxi University, No. 100, Daxuedong Road, Nanning 530004, People’s Republic of China
Hao Ren
State Key Laboratory of Featured Metal Materials and Life‑Cycle Safety for Composite Structures, School of Resources, Environment and Materials, Guangxi University, No. 100, Daxuedong Road, Nanning 530004, People’s Republic of China
Siwen Deng
State Key Laboratory of Featured Metal Materials and Life‑Cycle Safety for Composite Structures, School of Resources, Environment and Materials, Guangxi University, No. 100, Daxuedong Road, Nanning 530004, People’s Republic of China
Jianping Sun
State Key Laboratory of Featured Metal Materials and Life‑Cycle Safety for Composite Structures, School of Resources, Environment and Materials, Guangxi University, No. 100, Daxuedong Road, Nanning 530004, People’s Republic of China
Fangchao Cheng
State Key Laboratory of Featured Metal Materials and Life‑Cycle Safety for Composite Structures, School of Resources, Environment and Materials, Guangxi University, No. 100, Daxuedong Road, Nanning 530004, People’s Republic of China
Jingjing Jing
State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute of Sichuan University, Sichuan University, No. 24 South Section 1, Yihuan Road, Chengdu 610065, People’s Republic of China
Yinghong Chen
State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute of Sichuan University, Sichuan University, No. 24 South Section 1, Yihuan Road, Chengdu 610065, People’s Republic of China

Corresponding Author: Yinghong Chen

johnchen@scu.edu.cn

Nano-Micro Letters, Vol. 16 (2024), Article Number: 85

Abstract

Electromagnetic interference shielding (EMI SE) modules are the core component of modern electronics. However, the traditional metal-based SE modules always take up indispensable three-dimensional space inside electronics, posing a major obstacle to the integration of electronics. The innovation of integrating 3D-printed conformal shielding (c-SE) modules with packaging materials onto core electronics offers infinite possibilities to satisfy ideal SE function without occupying additional space. Herein, the 3D printable carbon-based inks with various proportions of graphene and carbon nanotube nanoparticles are well-formulated by manipulating their rheological peculiarity. Accordingly, the free-constructed architectures with arbitrarily-customized structure and multifunctionality are created via 3D printing. In particular, the SE performance of 3D-printed frame is up to 61.4 dB, simultaneously accompanied with an ultralight architecture of 0.076 g cm−3 and a superhigh specific shielding of 802.4 dB cm3 g−1. Moreover, as a proof-of-concept, the 3D-printed c-SE module is in situ integrated into core electronics, successfully replacing the traditional metal-based module to afford multiple functions for electromagnetic compatibility and thermal dissipation. Thus, this scientific innovation completely makes up the blank for assembling carbon-based c-SE modules and sheds a brilliant light on developing the next generation of high-performance shielding materials with arbitrarily-customized structure for integrated electronics.


Highlights:
1 3D printable functional inks incorporated with graphene and carbon nanotube nanoparticles were well-formulated by manipulating their rheological performance
2 The frame with ultralight structure (0.076 g cm−3) and high-efficiency electromagnetic interference shielding (61.4 dB) was assembled
3 3D-printed c-SE module was in situ integrated onto the electronics, affording multiple functions of electromagnetic compatibility and thermal dissipation.

Keywords

3D printing Carbon-based nanoparticles Conformal electromagnetic interference shielding Integrated electronics
Shi, Shaohong, Yuheng Jiang, Hao Ren, Siwen Deng, Jianping Sun, Fangchao Cheng, Jingjing Jing, and Yinghong Chen. 2024. “3D-Printed Carbon-Based Conformal Electromagnetic Interference Shielding Module for Integrated Electronics”. Nano-Micro Letters 16 (January):85. https://doi.org/10.1007/s40820-023-01317-w.
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