Issue

Vol. 18 (2026)

Integrated Circuits on Fiber Substrates: State-of-the-Art System-on-Fiber Technologies for Smart Textiles and Wearables

https://doi.org/10.1007/s40820-025-02056-w
Juyoung Jin
Department of Flexible and Printable Electronics, LANL‐JBNU Engineering Institute‐Korea, Jeonbuk National University, Jeonju 54896, Republic of Korea
Jonghyun Won
Department of Intelligence Semiconductor Engineering, Ajou University, Suwon 16499, Republic of Korea
Daegun Kim
School of Chemical, Biological and Battery Engineering, Gachon University, Seongnam 13120, Republic of Korea
Shiva Kumar Arumugasamy
School of Chemical, Biological and Battery Engineering, Gachon University, Seongnam 13120, Republic of Korea
Sungjun Park
Department of Intelligence Semiconductor Engineering, Ajou University, Suwon 16499, Republic of Korea
Tae‑Wook Kim
Department of Flexible and Printable Electronics, LANL‐JBNU Engineering Institute‐Korea, Jeonbuk National University, Jeonju 54896, Republic of Korea

Corresponding Author: Tae‑Wook Kim

twk@jbnu.ac.kr

Nano-Micro Letters, Vol. 18 (2026), Article Number: 232

Abstract

System-on-fiber technologies have emerged as a promising platform for seamless integration sensing, signal processing, and communication functionalities within textile-compatible fiber architectures. Advances in materials science and microscale fabrication have enabled the development of multifunctional fibers that serve as active components in large-scale woven systems. These fibers can perform a range of functions including sensing, data processing, and even neuromorphic computing. Despite their potential applications in wearable electronics, healthcare monitoring, and human–machine interfaces, the practical implementation stays in its infancy. Key challenges include limitation in device encapsulation, interconnect reliability, and scalable manufacturing. This review systematically summarizes recent advancements in manufacturing approaches for fiber-based integrated electronics, device configurations, and integration strategies. Furthermore, key technological hurdles and future opportunities for achieving fully integrated autonomous fiber-based electronic systems are discussed.


Highlights:
1 Presents a hierarchical overview of system-on-fiber (SoF) technologies, linking materials, fabrication methods, and device architectures from single-fiber electronics to system-level intelligent textiles.
2 Establishes a quantitative process–performance correlation framework, integrating AI-driven material optimization and comparative metrics (e.g., yield, endurance, and conductivity retention) across coating, thermal drawing, deposition, and spinning techniques.
3 Proposes a standardization and industrial translation roadmap outlining key steps testing certification, scalable manufacturing, and modular integration to move SoF systems from laboratory prototypes to consumer-ready smart textiles.

Keywords

Electronic fiber E-textile Integration Multifunctional e-textile Wearable electronics
Jin, Juyoung, Jonghyun Won, Daegun Kim, Shiva Kumar Arumugasamy, Sungjun Park, and Tae‑Wook Kim. 2026. “Integrated Circuits on Fiber Substrates: State-of-the-Art System-on-Fiber Technologies for Smart Textiles and Wearables”. Nano-Micro Letters 18 (February):232. https://doi.org/10.1007/s40820-025-02056-w.
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