Reactive wetting behaviors of Sn/Cu systems: A molecular dynamics study

J. Y. Hsieh; J. L. Chen; C. Chen; H. C. Lin; S. S. Yang; C. C. Hwang

doi:10.1007/BF03353620

Issue

Vol. 2 No. 2 (2010)

Issue Published : Apr 1, 2010

Reactive wetting behaviors of Sn/Cu systems: A molecular dynamics study

https://doi.org/10.1007/BF03353620

J. Y. Hsieh

Department of Mechanical Engineering, Ming Hsin University of Science and Technology, Hsinchu 30401, Taiwan

J. L. Chen

Department of Mechanical Engineering, WuFeng Institute of Technology, Chiayi 621, Taiwan

C. Chen

Department of Information Management, Meiho Institute of Technology, Pingtung 912, Taiwan

H. C. Lin

Department of Engineering Science, National Cheng Kung University, Tainan 70101, Taiwan

S. S. Yang

Department of Engineering Science, National Cheng Kung University, Tainan 70101, Taiwan

C. C. Hwang

Department of Engineering Science, National Cheng Kung University, Tainan 70101, Taiwan

Corresponding Author: C. C. Hwang

chchwang@mail.ncku.edu.tw

Nano-Micro Letters, Vol. 2 No. 2 (2010), Article Number: 60-67
Article Published : Apr 22, 2010

Abstract

Influences of temperature and Sn-Cu droplet’s composition on reactive wettings of Cu(100), Cu(110), and Cu(111) surfaces were analyzed, by using molecular dynamics (MD) calculations. As a result, the spreading on Cu(110)(Cu(100)) has the fastest (slowest) wetting kinetics. A higher temperature or a diluter Cu content in the Sn-Cu alloy droplet results in a higher wettability. Moreover, this work has addressed a theory for positioning the interface separating the liquidus and solidus alloys in the spreading film to confirm the hypothesis that the reactive wetting will come to the end when the interface saturates with the temperature-dependent solidus weight fraction of Cu.

Keywords

Wetting Surface alloying Molecular dynamics Droplet

Hsieh, J. Y., J. L. Chen, C. Chen, H. C. Lin, S. S. Yang, and C. C. Hwang. 2010. “Reactive Wetting Behaviors of Sn/Cu Systems: A Molecular Dynamics Study”. Nano-Micro Letters 2 (2):60-67. https://doi.org/10.1007/BF03353620.

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References

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References

M. Abtew and G. Selvaduray, Mater. Sci. Eng. 27, 95 (2000). doi:10.1016/S0927-796X(00)00010-3

K. J. R. Wassink and M. M. F. Verguld, Manufacturing Techniques for Surface Mounted Assemblies GB-Port Erin, British Isles: Electrochemical Publications Ltd., 1995.

C. Iwamoto and S. Tanaka, Acta. Mater. 41, 749 (2002). doi:10.1016/S1359-6454(01)00388-3

M. F. Arenas, M. He and V. L. Acoff, J. Electron. Mater. 35, 1530 (2006). doi:10.1007/s11664-006-0144-7

M. F. Arenas and V. L. Acoff, J. Electron. Mater. 33, 1452 (2004). doi:10.1007/s11664-004-0086-x

S. Amore, E. Ricci, T. Lanata and R. Novakovic, J. Alloys Compd. 452, 161 (2008). doi:10.1016/j.jallcom.2007.01.178

G. Drath, S. Sauerwald and Z. Anorg, Chemistry 162, 301 (1927).

J. Lee, W. Shimoda and T. Tanaka, Mater. Trans. 45, 2864 (2004). doi:10.2320/matertrans.45.2864

H. K. Kim and K. N. Tuv, Phys. Rev. B 53, 16027 (1996). doi:10.1103/PhysRevB.53.16027

K. Suganuma, K. Niihara, T. Shoutoku and Y. Nakamura, J. Mater. Res. 13, 2859 (1998). doi:10.1557/JMR.1998.0391

J. W. Jang, P. G. Kim and K. N. Tu, J. Mater. Res. 14, 3895 (1999). doi:10.1557/JMR.1999.0527

T. Takemoto and M. Miyazaki, Mater. Trans. 42, 745 (2001). doi:10.2320/matertrans.42.745

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H. Wang, F. Wang, F. Gao, X. Ma and Y. Qian, J. Alloys Compd. 433, 302 (2007). doi:10.1016/j.jallcom.2006.06.076

M. J. Rizvi, C. Bailey, Y. C. Chan and H. Lu, J. Alloys Compd. 438, 116 (2007). doi:10.1016/j.jallcom.2006.08.048

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F. Yost, E. O’Tool, Acta. Mater. 46, 5143 (1998). doi:10.1016/S1359-6454(98)00146-3

J. A. Warren, W. J. Boettinger and A. R. Roosen, Acta. Mater. 46, 3247 (1998). doi:10.1016/S1359-6454(97)00487-4

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E. B. Webb III, G. S. Grest and D. R. Heine, Phys. Rev. Lett. 91, 236102 (2003). doi:10.1103/PhysRevLett.91.236102

E. B. Webb III, G. S. Grest, D. R. Heine and J. J. Hoyt, Acta. Mater. 53, 3163 (2005). doi:10.1016/j.actamat.2005.03.021

M. I. Baskes, Phys. Rev. B 46, 2727 (1992). doi:10.1103/PhysRevB.46.2727

J. F. Aguilar, R. Ravelo and M. I. Baskes, Modelling Simul. Mater. Sci. Eng. 8, 335 (2000). doi:10.1088/0965-0393/8/3/313

H. Dong, L. Fan, K. Moon, C. P. Wong and M. I. Baskes, Modelling Simul. Mater. Sci. Eng. 13, 1279 (2005). doi:10.1088/0965-0393/13/8/006.

D. C. Rapaport, The Art of Molecular Dynamics Simulation, Cambridge University Press, London, 1997.

D. Frenkel and B. Smit, Understanding Molecular Simulation, Academic, San Diego, 1996.