WEI, C.; LIN, W.; WANG, L.; CAO, Z.; HUANG, Z.; LIAO, Q.; GUO, Z.; SU, Y.; ZHENG, Y.; LIAO, X.; CHEN, Z. Conformal Human–Machine Integration Using Highly Bending-Insensitive, Unpixelated, and Waterproof Epidermal Electronics Toward Metaverse. Nano-Micro Letters, [S. l.], v. 15, p. 199, 2023. DOI: 10.1007/s40820-023-01176-5. Disponível em: https://mail.nmlett.org/index.php/nml/article/view/1434. Acesso em: 17 nov. 2024.